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Patent No: IN515852 [India] Application No: IN201821040548
Title: Heating assembly
Issue Date: 27-02-2024 File Date: 26-10-2018
Inventor(s): Mulimani Jagdish; Nag Chowdhury Suvam; Sahu Kumar Ranjan; Mohanasundaram Madan; Veerappan Rajinikanth; Haldar Nimai; Bapari Himangshu
IPC Classification: F28D9/00, G01N29/24, G03G15/20, B32B15/08, C09J5/06
Abstract:
A heating assembly (100) for an electromagnetic induction heating device is disclosed. In an example, the heating assembly (100) comprises a first metal plate (102), second metal plate (104), and a heat insulator plate (108). The second metal plate (104) positioned in contact with the first metal plate (102), such that a first surface of the second metal plate (104) is in contact with the first metal plate (102). The first metal plate (102) comprises at least one recess (106) to provide a passage to electromagnetic radiation, such that the electromagnetic radiation reaches the second plate (104). The heat insulator plate (108) is positioned in contact with a second surface of the second metal plate (104)

Startup Options: Advanateges:
  • The multilayer configuration  helps in retaining heat for longer period of time. This increases the performance efficiency of the heating assembly and also improves the userÂ’s experience.
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Industrial Applications Devices [Electrical] Electromagnetics [Physics]