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Publication No: IN202311053163 [India] Application No: 202311053163
Title: A sensing device for in-situ health monitoring of engineering components exposed to high- temperature and stress
Publication Date: 14-02-2025 File Date: 07-08-2023
Inventor(s): Tarun Kumar Das; Chandan Dutta; Avijit Kumar Metya; Avinow Raj; Sarmishtha Palit Sagar
IPC Classification: G01N 27/90, A61B 5/11, G08B 21/18, A61B 5/00, B64D 45/00
Abstract:
The present invention relates to a sensing device for in-situ health monitoring of critical engineering components exposed to high temperature and stress. The system  includes a high-temperature sustainable electromagnetic sensor that works on the principle of eddy current (EC), in which electromagnetic induction at a metallic  component under inspection causes impedance variations due to damage. In-situ sensor, sensing device, and embedded software are its main components. It can  perform real-time EC inspection in multiple modes of eddy current testing with the sensor fixed to the target component operating at 600 0C or higher. The embedded  software performs multiple EC inspections and post-processing of acquired EC signals to generate damage signatures.
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