A piezoelectric MEMS sensor consists of an electrode-equipped diaphragm, a substrate with a through hole cavity in silicon, and a microtunnel diced within the sealing  glass substrate. The fabrication process for MEMS Piezoelectric Sensor for Biomedical Applications comprising the steps of: a) Development of microtunnel structure  in glass instead of silicon substrate by using dicing technique b) Dicing of Al/PVDF/Al diaphragm by using dicing machine with a diamond blade, c) Creating a through  hole cavity in silicon wafer, d) Bonding of Silicon and glass chip, e) Fixing of piezoelectric layer (Al/PVDF/Al) on front side of fabricated silicon-glass substrate. The  fabricated silicon structure is utilized as a substrate to fix the diced piezoelectric diaphragm. The diaphragm positioning and bonding technique is less complicated,  more affordable, and less time-consuming. The present invention process is economical and offers a measurement of low sound pressure level for biomedical  applications because of the streamlined fabrication procedure.