CSIR Technology Portal
CSIR Technology Portal

 Technology Profile

Title:

Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer
Value Proposition:

Using this technology, the plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions.
Summary Application:

Used for bearings.
Advantages:
  • Good mechanical properties
  • Eliminating hazardous Pb in the alloy composition (Lead free process)
  • Good cathodic current efficiency
  • Good plating rate
  • Simplest process.
Commercialization Status: Already Commercialised
Tech. Readiness Level:
CSIR-Central Electro Chemical Research Institute
CSIR-Central Electro Chemical Research Institute[CSIR-CECRI]
:  director[at]cecri[dot]res[dot]in
:91-4565-227777
:https://www.cecri.res.in
Industrial Applications: Catalyst [Fuels and Lubricants] Coatings [Metallurgy] Engine and Motors [Mechanical]