The invented method is to realize a silicon chip carrier using wet bulk micromachining of silicon. In the silicon chip carrier, three (or more) supports are realized solely based on the wet etching of the silicon. The fabricated supports are triangular in shape and provide a minimum contact area between the sensing element and carrier. The invention provides a simple, cost-effective fabrication technology, which uses anisotropic wet etchant for silicon bulk-micromachining. A fabricated silicon wafer can be diced as per the requirement of single/multiple channel IR detectors. These chip carriers will cut down the IR detector cost with attractive lower thermal conductance in the field of gas sensors, spectrometry, thermal imaging, and fire detection.