| Publication No: | IN202411036884 [India] | Application No: | IN202411036884 |
| Title: | Micro-electro- Mechanical Systems (MEMS)) micro-thermal flow sensor structure and process of fabrication thereof | ||
| Publication Date: | 28-11-2025 | File Date: | 09-05-2024 |
| Inventor(s): | Jitendra Singh; Deepak Kumar Panwar; Arvind Kumar Singh; Prateek Kothari; Prashant Sharma | ||
| IPC Classification: | G01F1/684, G01F1/692, G01K7/18, B81B3/00, B81C1/00 | ||
| Abstract: | Micro-Electro-Mechanical Systems (MEMS) Micro-Thermal Flow Sensor and process of fabrication thereof A Micro-Electro-Mechanical Systems (MEMS) Micro- Thermal Flow Sensor structure and process of fabrication thereof comprising a bilayer of silicon dioxide (6) and Silicon nitride (Si3N4) (7) deposited on a single crystal Silicon-(100) (5) oriented wafer, triangular shaped windows (8), (9), a micro-heater (13), two RTDs (14), (15), a recess gap (12), contact pads (18), (19), upstream RTD Contact pads (20), (21) and downstream RTD contact pads (22), (23). Resistance temperature detectors (RTDs) are used to measure temperature distribution profile. When there is no flow exist, temperature distribution profile is symmetric around the heat source and therefore upstream RTD (Tu), downstream RTD (Td) temperature is similar. Successively, when flow is pass through the sensor chip, heat is transported along the flow direction. Micro-heater thermal isolation is provided by recess gap creation underneath the heat source. Heat source is fabricated on a stress-compensated, Si3N4/SiO2 bilayer membrane. The fabrication process is low-cost and reliable. |
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